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Intel® Core™ - 5th Generation
  • 125 x 95
  • 55W
  • 0 - 60 °C

MSC C6B-8SB

Description

The MSC C6B-8SB module is based on Intel's 5th generation of Core™ processors manufactured in 14 nm technology. It supports triple independent displays, DirectX 11.1, fast low-power DDR3L-1600 memory and USB 3.0 on a COM Express module. This product family brings a significant gain in computing and graphics performance compared to its predecessor. The new design supplements the 4th generation platform at the high end with four quad-core i7 and Xeon processors. Besides an extensive set of interfaces and features, the MSC C6B-8SB offers turbo boost capabilities for CPU and graphics controller, accelerated video encoding / decoding and hardware based security compliant to the requirements of TCG (Trusted Computing Group).  The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI and DVI. Four USB 3.0 interfaces support the fastest peripheral devices currently available.
  • Highlights
  • Specs
  • Order Info
  • Accessories
  • Documents

Intel® Core™ i7-5850EQ (quad-core, 2.7/3.4GHz),

Intel® Core™ i7-5700EQ (quad-core, 2.6/3.4GHz),

Intel® Xeon® E3-1278LV4 (quad-core, 2.0/3.3GHz),

Intel® Xeon® E3-1258LV4 (quad-core, 1.8/3.2GHz)

Intel® HD Graphics GT2 or GT3e

Intel® 8-Series chipset

Up to 16GB DDR3L-1600 SDRAM, dual channel

Four SATA mass storage interfaces (up to 6Gb/s)

Three DisplayPort/HDMI/DVI interfaces

Two Embedded DisplayPort interfaces

LVDS (24 Bit, dual channel) and CRT interface

Triple independent display support

DirectX 11.1, OpenGL 3.2, OpenCL 1.2

Resolution up to 3800 x 2400

Seven PCI Express™ x1 lanes

Four USB 3.0 and four USB 2.0 interfaces

UEFI Firmware

Technical Data - MSC C6B-8SB

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Technology

x86

Formfactor

COM Express Basic

CPU

Intel® Core™ i7-5850EQ (quad-core, 2.7/3.4GHz, 6MB cache, 47/37W TDP),

Intel® Core™ i7-5700EQ (quad-core, 2.6/3.4GHz, 6MB cache, 47/37W TDP),

Intel® Xeon® E3-1278LV4 (quad-core, 2.0/3.3GHz, 6MB cache, 47W TDP),

Intel® Xeon® E3-1258LV4 (quad-core, 1.8/3.2GHz, 6MB cache, 47W TDP)

Chipset

Intel® 8-Series Platform Controller Hub (PCH) QM87

RAM

up to 16GB DDR3L (1333/1600), 2x 204 pin SO-DIMM, dual-channel

Storage Interfaces

4x SATA up to 6Gb/s

USB

4 x USB 3.0,

4 x USB 2.0

Bus Interfaces

7x PCI Express x1,

1x PCI Express Graphics (PEG) x16,

LPC bus (Low Pin Count bus)

Display Controller

Intel® HD Graphics 5600, P5700, Iris Pro Graphics 6200, P6300; on processor die (supporting Graphics Turbo Boost and Accelerated Encode/Decode

 

DirectX 11.1, OpenGL 3.2 and OpenCL 1.2 supported

Triple independant display support

Display Memory

UMA

Display Interfaces

3x Display Port 1.2, two also usable as HDMI/DVI, up to 3800x2400,

2x Embedded DisplayPort,

Analog interface, up to 1920 x 2000,

LVDS 18/24 bit, dual channel; shared with one Embedded DisplayPort

Network Interface

10/100/1000Base-TX

Audio Interface

High Definition Audio

Security Device

TPM 1.2

Miscellaneous

Watchdog Timer:

Initiates system reset, programmable

Fan Supply:

4-pin header (12V), PWM speed control,

RTC battery: external

System Monitoring:

voltage, temperature, CPU fan

Feature Highlights

Type 6 pin-out

Firmware

AMI Aptio UEFI

OS Support

Windows 8

Windows 7 (embedded)

BSP for Linux on request

EAPI (HW Programming Interface)

Power Requirement

+12V+/-10%, 5V Stby optional,

35 W (typ.) up to 55 W (typ.)

Environment

Ambient Temperature;

0° … 60°C (operating),

-25° … 85°C (storage)

Humidity:

5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing)

Dimensions

125mm x 95mm

Certificates

UL / CE

Order Reference - MSC C6B-8SB

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Order No. Description Reference Status  
65563 COM Express Type 6 Basic module (125mm x 95mm);
CPU: quad-core Intel Core i7-5850EQ at 2.6/3.4GHz, 6MB L3, 47/37W TDP;
Chipset: QM87 PCH;
Graphics: integrated GT3e; various display interfaces;
Ethernet: Intel i217 Gbit;
Infineon TPM; HD audio; seven PCIe x1, PCIe x16 PEG;
2x socket for DDR3 SO-DIMM.
MSC C6B-8SB-008 PCBFTX OR
65565 COM Express Type 6 Basic module (125mm x 95mm);
CPU: quad-core Intel Core i7-5700EQ at 2.7/3.4GHz, 6MB L3, 47/37W TDP;
Chipset: QM87 PCH;
Graphics: integrated GT2; various display interfaces;
Ethernet: Intel i217 Gbit;
Infineon TPM; HD audio; seven PCIe x1, PCIe x16 PEG;
2x socket for DDR3 SO-DIMM.
MSC C6B-8SB-011 PCBFTX OR
67455 COM Express Type 6 Basic module (125mm x 95mm);
CPU: quad-core Intel Xeon E3-1258Lv4 at 1.8/3.2GHz, 6MB L3, 47W TDP;
Chipset: QM87 PCH;
Graphics: integrated GT2; various display interfaces;
Ethernet: Intel i217 Gbit;
Infineon TPM; HD audio; seven PCIe x1, PCIe x16 PEG;
2x socket for DDR3 SO-DIMM.
MSC C6B-8SB-021 PCBFTX OR
67453 COM Express Type 6 Basic module (125mm x 95mm);
CPU: quad-core Intel Xeon E3-1278Lv4 at 2.0/3.3GHz, 6MB L3, 47W TDP;
Chipset: QM87 PCH;
Graphics: integrated GT3e; various display interfaces;
Ethernet: Intel i217 Gbit;
Infineon TPM; HD audio; seven PCIe x1, PCIe x16 PEG;
2x socket for DDR3 SO-DIMM.
MSC C6B-8SB-022 PCBFTX OR
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PV = Preferred variant; OR = on Request (in OEM quantities only)

Accessory

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Carrier Options
Order No. Description Reference
41886 COM Express Type 6 Small Test and Evaluation Board with one PCI Express socket, USB 3.0, GbE, SATA, DisplayPort, HDMI, VGA and HD audio interfaces MSC C6-AD-T6T2 PCBFTX
67295 COM Express Type 6 Evaluation Carrier Board with PCI Express x4/x16 slot, USB 3.0/2.0, GbE, SATA, DisplayPort, eDP/LVDS, VGA and HD audio interfaces; Mini PCI Express socket, SD card slot, ATX power connector and single 12V power jack. Dimensions: 170mm x 170mm (Mini-ITX form factor) MSC C6-MB-EV-001 PCBFTX
41857 COM Express Type 6 Evaluation board with various PCI Express interfaces, SATA and mSATA, USB 2.0/3.0, Display Port and eDP, HDMI/DVI, HD-Audio, POST code display. ATX form factor MSC C6-MB-EVA
Cooling Options
Order No. Description Reference
1111682 Active Heatsink for C6B-8S, C6B-8SB and CXB-8S, consisting of a single- piece aluminum profile with fins, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset. PWM fan 80x80x15mm. MSC C6B-8S-01 HSF-001
1110030 Passive Heatsink for C6B-8S, C6B-8SB and CXB-8S, consisting of a single- piece aluminum profile with fins, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset. MSC C6B-8S-01 HSI-001
1120478 Heatspreader for C6B-8S, C6B-8SB and CXB-8S. Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset. No fan, no SO-DIMM cutout. MSC C6B-8S-01 HSP-001
1124456 Active Heatsink for C6B-8S, C6B-8SB and CXB-8S consisting of a single- piece aluminum profile with fins, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset. PWM fan 80x80x15mm. No memory cutout. MSC C6B-8S-02 HSF-001
1121199 Passive Heatsink for C6B-8S, C6B-8SB and CXB-8S consisting of a single- piece aluminum profile with fins, pressed in threaded standoffs (M2.5), screws and thermopads for the thermal contact to CPU and chipset. MSC C6B-8S-02 HSI-001
1120479 Heatspreader for C6B-8S, C6B-8SB and CXB-8S. Single-piece aluminum profile, pressed in standoffs with M2.5 thread, screws and thermopads for the thermal contact to CPU and chipset. No fan, no SO-DIMM cutout. MSC C6B-8S-02 HSP-001
1123276 Passive Heatsink for C6B-8S, C6B-8SB and CXB-8S consisting of a single- piece aluminum profile with fins, pressed in threaded standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset. No memory cutout. MSC C6B-8S-03 HSI-001
Memory Options
Order No. Description Reference
1102661 DDR3 SODIMM 4GB PC1600, 512Mx64, based on 512Mx8, single rank, 1,35V HMT451S6AFR8A-PBN0
1124891 DDR3L SODIMM, 2GB, PC1600, 1.35V MSC3S2G1600B2LSQSC
1128243 4GB DDR3-1600 SoDimm, 512Mx8 based, 1.35V MSC3S4G1600B2LSESC
Starter Kits
Order No. Description Reference
46417 COM-Express Type 6 Starterkit for Intel fourth generation core processors consisting of a Type 6 baseboard, the active heatsink with fan for the C6B-8S Type 6 module, and two DDR3L SO-DIMM memory modules. Please order separately the COM-Express C6B-8S module of your choice. MSC C6-SK-8S-T6T2-KIT001

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